BioSwitch

The separation of an adhesive bond can be carried out both chemically and physically. Preference is given to physical separation processes, which can still be subdivided into thermal and mechanical processes. A thermal separation process is the pyrolysis of the adhesive. Depending on the temperature range, the joining partners may also be damaged. In mechanical processes, the joint is separated by cutting or breaking, which can also cause damage to the parts to be joined. The formulation of blowing agents offers a combination of thermal and mechanical separation processes. The blowing agent increases its volume enormously above a certain temperature. This reduces the strength of the bonded joint and enables easy separation of the joining partners.

The overall aim of the project is to investigate sustainable adhesive formulations and processing processes that enable reversible bonding and debonding of joining partners by induction. In line with the call for tenders for Technological Resource Protection issued by the Baden-Württemberg Ministry of Finance and Economic Affairs, the work planned in the project represents an important contribution to a secure, stable and affordable supply of raw materials, as it enables efficient joining and separation processes as well as non-destructive separation and reuse or material recycling of components made of strategically important and economically attractive materials.

Fast adhesive curing by means of an external stimulus enables rapid curing with long processing times. The "formulation" of nanoparticles and propellants is intended to achieve better properties of the adhesives than by mixing them in.

The essential, innovative aspect of the project is the use of biogenic, hyperbranched polypeptides, for the functionalization of which covalently crosslinkable groups, blowing agents and polymer-bound nanoparticles are used as essential building blocks of the adhesive formulations. In comparison to existing solutions based on high-frequency technology, the use of new inductors at lower frequencies will lead to improved scalability for inductive curing and switching of the adhesives. This approach is intended to solve the many problems that have arisen so far in the introduction of switchable adhesive bonds into bonding technology.