Areas of activity
Nanotechnology, nanolithography with electron and ion beams, electron beam and ion beam induced material deposition (additive nanolithography), electron microscopy, development of preparation methods, thin film technology, microsystems technology
Stages of career
2018 - today Group Leader Applied Materials Science and Electron Microscopy
2008 - 2017 Group Leader Microsystems and Nanotechnology
1998 - 2007 Research Associate at the NMI, Project Manager
1995 - 1997 Research assistant at the Hearing Research Centre Tübingen
1997 Doctorate at the University of Tübingen
1986 - 1992 Research Assistant, PhD Student, University of Tübingen, Institute of Applied Physics
1979 - 1986 Physics studies, University of Tübingen
Stages of career
since 2012 NMI, Project leader Nano analytics, Head of NMI Nano analytic laboratory, Physicist
2007-2012 Senior experimental Officer, Marie-Curie senior research fellow (EU/FP7), CRANN/Trinity College, Dublin, Ireland
2005-2007 Staff engineer, Physicis, Qimonda, Dresden, Germany
2004-2005 Senior researcher, Physicist, Infineon, Cooperate Research (CPR) Munich, Germany
1999-2004 Senior engineer, Physicist, Infineon, Mask House, Munich, Germany
1997-1999 Physicist; Masterstudent, NMI Reutlingen,Germany
1997-1998 Kleindiek Nanotechnik, Reutlingen, Germany
Education:
2007-2012 Trinity College Dublin, Dublin, Ireland
- Contact interface studies of metal and carbon electrodes to germanium nanowires, carbon nanotubes and thin carbon films in associated devices”
- PHD Thesis conducted at the School of Physics at the Trinity College in Dublin (Ireland)
1997-1998 University of Tübingen, Tuebingen, Germany
- “Target preparation strategies using focused Ion beam technique (FIB) to investigate internal interfaces in Transmission Electron Microscopy”
- Master Thesis conducted at the Bosch Research Center and the Natural and Medical Science Institute (NMI)
1998-1997 University of Tübingen, Tuebingen, Germany
Publications outside the NMI
Contact resistivity and suppression of Fermi level pinning in side-contacted germanium nanowires; MM Koleśnik-Gray, T Lutz, G Collins, S Biswas, JD Holmes, V Krstić; Applied Physics Letters 103 (15), 153101 9 2013
Fabrication of a sub-10 nm silicon nanowire based ethanol sensor using block copolymer lithography; S Rasappa, D Borah, CC Faulkner, T Lutz, MT Shaw, JD Holmes, ...; Nanotechnology 24 (6), 065503 22 2013
Contact Interface Studies of Metal and Carbon Electrodes to Germanium Nanowires, Carbon Nanotubes and Thin Carbon Films in Associated Devices; T Lutz; Trinity College Dublin 2013
Free-Standing, Single-Crystal Cu3Si Nanowires; SJ Jung, T Lutz, AP Bell, EK McCarthy, JJ Boland; Crystal Growth & Design 12 (6), 3076-3081 22 2012
Large-scale parallel arrays of silicon nanowires via block copolymer directed self-assembly; RA Farrell, NT Kinahan, S Hansel, KO Stuen, N Petkov, MT Shaw, ...; Nanoscale 4 (10), 3228-3236 51 2012
Resolving In Situ Specific‐Contact, Current‐Crowding, and Channel Resistivity in Nanowire Devices: A Case Study with Silver Nanowires; MM Koleśnik, S Hansel, T Lutz, N Kinahan, M Boese, V Krstić; Small 7 (20), 2873-2877 11 2011
Anisotropic etching induced by surface energy driven agglomeration; S Jung Jung, T Lutz, JJ Boland; Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 29 (5 … 7 2011
Surface energy driven agglomeration and growth of single crystal metal wires; SJ Jung, T Lutz, M Boese, JD Holmes, JJ Boland; letters 11 (3), 1294-1299 13 2011
Nanoscale mapping of electrical resistivity and connectivity in graphene strips and networks; PN Nirmalraj, T Lutz, S Kumar, GS Duesberg, JJ Boland; Nano letters 11 (1), 16-22 91 2010
Transparent ultrathin conducting carbon films; M Schreiber, T Lutz, GP Keeley, S Kumar, M Boese, S Krishnamurthy, ...; Applied Surface Science 256 (21), 6186-6190 30 2010
An investigation of the electrical properties of pyrolytic carbon in reduced dimensions: Vias and wires; AP Graham, G Schindler, GS Duesberg, T Lutz, W Weber; Journal of Applied Physics 107 (11), 114316 22 2010
Transparent ultrathin conducting carbon films; M BOESE, GS DUESBERG, T LUTZ, S KUMAR; Applied Surface Science; 2010
Gas phase controlled deposition of high quality large-area graphene films; S Kumar, N McEvoy, T Lutz, GP Keeley, V Nicolosi, CP Murray, WJ Blau, ...; Chemical communications 46 (9), 1422-1424 44 2010
CVD Growth of Nanocarbons for Device Applications; N Mc Evoy, S Kumar, T Lutz, G Keeley, W Blau, G Duesberg; Meeting Abstracts, 2213-2213 2009
Low temperature graphene growth; S Kumar, N McEvoy, T Lutz, G Keeley, N Whiteside, W Blau, GS Duesberg; ECS Transactions 19 (5), 175-181 7 2009
One-and Two-Dimensional Carbon Nanostructures for applications in Microelectronic Devices and Electrochemical Sensors; G Keeley, T Lutz, N McEvoy, S Kumar, M Schreiber, N Whiteside, ...; Meeting Abstracts, 1313-1313 2009
Fabrication of all-Carbon Nanodevices; T Lutz, S Krishnamurthy, M Schreiber, G Keeley, GS Duesberg; Meeting Abstracts, 2135-2135 2008
Process for producing a mask; T Lutz, J Schneider; US Patent 7,410,732 2008
Integration of EBDW of one entire metal layer as substitution for optical lithography in 220 nm node microcontrollers; J Kretz, H Roeper, C Arndt, T Bischoff, KH Choi, G Goldbeck, M Gunia, ...; Microelectronic Engineering 85 (5-6), 792-795 9 2008
Determination of best focus and optimum dose for variable shaped e-beam systems by applying the isofocal dose method; K Keil, KH Choi, C Hohle, J Kretz, T Lutz, L Bettin, M Boettcher, ...; Microelectronic Engineering 85 (5-6), 778-781 6 2008
Evaluation of hybrid lithography and mix and match scenarios for electron beam direct write applications; C Hohle, C Arndt, KH Choi, J Kretz, T Lutz, F Thrum, K Keil; Journal of Vacuum Science & Technology B: Microelectronics and Nanometer … 8 2007
Apparatus and method for determining physical properties of a mask blank; T Lutz, M Menath; US Patent 7,289,231 2007
CD control of direct versus complementary exposure for shaped beam writers and its correlation to the local registration error; F Thrum, KH Choi, T Lutz, C Hohle, C Arndt, M Tesauro, MT Bootsmann, ...; Microelectronic engineering 84 (5-8), 1033-1036 3 2007
Fabrication of a nano-scale NAND memory array based on a SONOS Fin-FET cell using e-beam lithography and hydrogen-silsesquioxane resist; T Lutz, M Specht, L Risch, C Friederich, L Dreeskornfeld, J Kretz, ...; Microelectronic engineering 84 (5-8), 1578-1580 7 2007
Defect inspection of positive and negative sub-60nm resist pattern printed with variable shaped E-Beam direct write lithography; C Arndt, C Hohle, J Kretz, T Lutz, M Richter, K Keil, M Lapidot, D Zemach, ...; Emerging Lithographic Technologies XI 6517, 651711 2007
Data preparation for EBDW; F Thrum, J Kretz, T Lutz, K Keil, C Arndt, KH Choi, U Baetz, N Belic, ...; Mask and Lithography Conference (EMLC), 2007 23rd European, 1-8 3 2007
Multi-level p+ tri-gate SONOS NAND string arrays; C Friederich, M Specht, T Lutz, F Hofmann, L Dreeskornfeld, W Weber, ...; Electron Devices Meeting, 2006. IEDM'06. International, 1-4 17 2006
Method for detecting and compensating for positional displacements in photolithographic mask units and apparatus for carrying out the method; J Schneider, T Lutz; US Patent 7,087,910 5 2006
Comparison of trimming techniques for sub-lithographic silicon structures; L Dreeskornfeld, AP Graham, J Hartwich, J Kretz, E Landgraf, T Lutz, ...; Japanese journal of applied physics 45 (6S), 5552 5 2006
Influence of crystal orientation and body doping on trigate transistor performance; E Landgraf, W Rösner, M Städele, L Dreeskornfeld, J Hartwich, ...; Solid-state electronics 50 (1), 38-43 46 2006
Comparison of trimming techniques for sub-lithographic silicon structures; L Dreeskornfeld, AP Graham, J Hartwich, E Landgraf, T Lutz, W Rosner, ...; Microprocesses and Nanotechnology Conference, 2005 International, 152-153 2005
Method for compensating for scatter/reflection effects in particle beam lithography; C Ebi, F Erber, T Franke, F Gans, T Lutz, G Ruhl, B Schönherr; US Patent 6,953,644 1 2005
Planar double gate transistors with asymmetric independent gates; G Ilicali, W Weber, W Rosner, L Dreeskornfeld, J Hartwich, J Kretz, T Lutz, ...; SOI Conference, 2005. Proceedings. 2005 IEEE International, 126-127 10 2005
Comparative study of calixarene and HSQ resist systems for the fabrication of sub-20 nm MOSFET device demonstrators; J Kretz, L Dreeskornfeld, G Ilicali, T Lutz, W Weber; Microelectronic engineering 78, 479-483 19 2005
Investigation of Low Damage Mask Repair by Combination of Electron Beam and Scanning Force Technology; C Burkhardt, S Bauerdick, V Bucher, W Barth, A Ehrmann, T Lutz, J Rau, ...; Micro and Nano Engineering 1 2002
FOx-12 flowable oxide ; L Dreeskornfeld, AP Graham, J Hartwich, J Kretz, E Landgraf, T Lutz, ...;
Proc. Micro-and Nano Engineering 2005 Proc. Micro-and Nano Engineering 2005, 2005; L Dreeskornfeld, AP Graham, J Hartwich, J Kretz, E Landgraf, T Lutz, ...
IEDM Tech. Dig., 2004 IEDM Tech. Dig., 2004, 2004; L Dreeskornfeld, AP Graham, J Hartwich, J Kretz, E Landgraf, T Lutz, ...
Areas of activity
- Micro- and Nanotechnology
- thin film technology
- Electron and ion beam technology
- Electron microscopy and microanalysis
- Vacuum and cryo technology
Areas of interest
- FIB/SEM Crossbeam
- cryomicroscopy
- preparation methods
- Analytics of biological-technical interfaces
- electron microscopy
Stages of career
Since 2009 research associate in the Microsystems and Nanotechnology Group at the NMI
2011 PhD in Applied Physics on the development of an ion optical transfer system for a mass spectrometer
2004-2009 Research Assistant at the Institute of Applied Physics, Working Group Electron and Ion Optics
1997-2004 Study of physics at the Eberhard-Karls University Tübingen
